11Bottles 11 Sizes 25K Solder Balls 0.2mm-0.76mm Leaded BGA Soldering Balls Reball Reballing Ball Sn63% Pb37% (25000pcs/bottle) for GPU CPU IC Chip

Material: Tin Sn63% Pb37%; 25,000pcs per bottle; Diameter: 0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm 0.55mm 0.6mm 0.65mm 0.76mm Application: Tin balls are mainly used to connect semiconductor chips, circuit templates and PCB boards, and ultra small spherical tin electronic parts that transmit electronic.

• ALL SIZES -- Size from 0.2mm to 0.76mm, totally 11 bottles, 25K solder balls (0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm 0.55mm 0.6mm 0.65mm 0.76mm)
• HIGH QUALITY -- Made of high quality BGA lead solder tin material, very useful for welding work and can be heated by the hot air machine, stable, durable and can be used for a long time
• EASY TO USE -- These tin balls are easily used for connection of semiconductor chip, circuit module and PCB board, they are quite small and can transmit electronic , very useful for your soldering work
• PERFECT MATCH -- Choose the right size for your chip stencil and the balls will perfectly matched, undoubtedly a reliable tool for industrial soldering applications, making your work efficient and cost-effective
• INTIMATE SERVICE -- If you have any dissatisfaction or questions, please feel free to contact us and we will, within 24 hours, arrange a best solution for you